Page 881 - Mechanical Engineers' Handbook (Volume 2)
P. 881

872   Introduction to Microelectromechanical Systems (MEMS): Design and Application





























                          Figure 7 Photographs of exterior of new two-axis microaccelerometers in leadless packages on a penny
                          and micrograph of chip from Analog Devices. In this device, the microelectronic and micromechanical
                          components are tightly integrated on the silicon substrate.


           6  CONCLUSIONS
                          We have discussed the advances in the microfabrication structures that allowed the realization
                          of three-dimensional structures at the micrometer scale. As listed above, the materials and
                          microfabrication processes used are unlimited to realize MEMS devices. Many MEMS in-
                          volve several mechanical structures which behave differently on the micrometer spatial scale.
                          Several CAD tools were developed to aid in the design of such devices. The design of such
                          miniature devices is challenging and complicated as compared to devices at the macroscale
                          level. Despite such engineering challenges, MEMS offer high performance and are small,
                          have low power, and are relatively inexpensive. They both improve on some existing appli-
                          cations and enable entirely new systems. Some applications are targeted from the outset of
















                                                   Figure 8 Circular resonators.
   876   877   878   879   880   881   882   883   884   885   886