Page 882 - Mechanical Engineers' Handbook (Volume 2)
P. 882
Appendix: Books on MEMS 873
Ground Undercut
access
Membrane
holes
Signal
path
Lower
electrode
Ground
Top view
Dielectric
Electrode
Dielectric
Buffer layer
High- resistivity silicon
Cross section
Figure 9 Microwave switch.
design, but others are opportunistic. That is, the large number of MEMS components on the
market makes them available to design engineers for a very wide variety of uses.
APPENDIX: BOOKS ON MEMS
A great deal of information on the design, simulation, fabrication, packaging, testing, and
application of MEMS is available. This information is presented as journal articles, confer-
Figure 10 Scanning electron micrograph of CMOS gas sensor.
