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CRYSTALLINE, AMORPHOUS, THIN-FILM, AND SUN-TRACKER TECHNOLOGIES  53



                                                   SEED
                                                   SILICON INGOT

                                                   QUARTZ CRUCIBLE
                                                   WATER COOLED JECKET
                                                   HEAT SHIELD
                                                   CARBON HEATER

                                                   GRAPHITE CRUCIBLE
                                                   GRUCIBLE SUPPORT
                                                   SPILL TRAY
                                                   ELECTRODE





                        Figure 3.16  Czochralski crystallization furnace.



                       process involves inserting a metal whisker into molten silicon and pulling it out with
                       increasing velocity. This allows for the formation of a pure crystal around the wire and
                       thus is a successful method of growing  single crystals.  The process  was further
                       enhanced by attaching a small silicon crystal seed to the wire rod. Further production
                       efficiency was gained by attaching the seed to a rotatable and vertically movable spin-
                       dle. Incidentally, the same crystallization apparatus is also equipped with special dop-
                       ing ports where P- or N-type dopants are introduced into the crystal for generation of
                       PN- or NP-junction-type crystals used in the construction of NPN or PNP transistors,
                       diodes, LEDs, solar cells, and virtually all large-scale, high-density integrated circuitry
                       used in electronic technologies.
                         The chemical vaporization and crystallization process described here is energy-inten-
                       sive and requires a considerable amount of electric power. To produce purified silicon
                       ingots at a reasonable price, in general, silicon ingot production plants are located with-
                       in the vicinity of major hydroelectric power plants, which produce an abundance of
                       low-cost hydroelectric power. Ingots produced from this process are either circular or
                       square in form and are cleaned, polished, and distributed to various semiconductor-
                       manufacturing organizations. Figure 3.17 shows silicon ingot cylinders inspection.


                       Solar cell production The first manufacturing step in the production of PV modules
                       involves incoming ingot inspection, wafer cleaning, and quality control. On comple-
                       tion of the incoming process, in a clean-room environment, the ingots are sliced into
                       1-mm-thick wafers, and both surfaces are polished, etched, and diffused to form a PN
                       junction. After being coated with antireflective film, the cells are printed with a
                       metal-filled paste and fired at high temperature. Each individual cell is then tested for
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