Page 10 - Bebop to The Boolean Boogie An Unconventional Guide to Electronics Fundamentals, Components, and Processes

Contents ix

Chapter I5 Memory ICs ............ 162 Chapter 18 Circuit Boards ......... 221
Underlying RPLM and ROM The First Circuit Boards .............. 221
Architectures ........................ 165 PCBs and PWBs .......................... 222
Increasing Width and Depth ...... 170 Subtractive Processes .................. 222
Alternative Technologies ........... I 72 Additive Processes ...................... 225
Single-sided Boards ..................... 226
Chapter I6 Programmable ICs ... 178 Lead Through-Hole (LTH) ........ 229
Fusible-link Technologies ........... 1 79 Surface Mount 'Technology
Antifuse Technologies ................ 179 (SMT) ................................... 231
Special PLD Notation ................. I81 Double-sided Boards .................... 233
Generic PLD Structures .............. I82 Holes versus Vias ......................... 235
Programmable Logic Arrays Multilayer Boards ........................ 237
(PLAs) .................................. 183
Programmable Array Logic Microvia, HID, and Build-up 241
Technologies .........................
(PAL) .................................... 184
Programmable Read-only Discrete Wire Technology .......... 243
Memories (PROMS) ............. 185 Backplanes and Motherboards .... 252
Additional Programmable Conductive Ink Technology ....... 253
Options ................................. 186 Chip-On-Board (COB) .............. 255
Programming PLDs ..................... 189 Flexible Printed Circuits (FPCs) 256
Reprogrammable PLDs ................ 191 Chapter 19 Hybrids ................. 258
Complex PLDs (CPLDs) ............. 195 Hybrid Substrates ........................ 258
Field-Programmable Gate
Arrays (FPGAs) .................... 196 The Thick-Film Process .............. 260

Why Use Programmable ICs? ..... 199 The Thin-Film Process ............... 265
The Assembly Precess ................. 268
Chapter I 7 Application-Specific The Packaging Process ................ 273
Integrated Circuits
(ASlCs) .................. 201 Chapter 20 Multichip Modules
Gate Array Devices ..................... 202 (MCMs) .................. 275

Standard Cell Devices ................. 206 Categorization by Substrate ........ 276
Full Custom Devices ................... 208 Why Use Multichip Modules? .... 277
Input/Output Cells and Pads ...... 209 Cofired Ceramics ........................ 279
Who Are All the Players? ........... 21 0 Low-fired Cofired Ceramics ........ 282
e ASIC Design Flow ............... 21 3 Assembly and Packaging ............. 283
ASIC. ASSP. and COT .............. 21 8 Equivalent Integrated Circuits .... 287
Summary ..................................... 2 19 The Mind Boggles ....................... 288