Page 476 - Handbook of Adhesives and Sealants
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412   Chapter Ten


            by water. Water resistance can be improved by applying suitable alu-
            minum salts to substrates such as paper prior to bonding. Addition of
            sugar, glycerin, and other materials promotes retention of moisture in
            the film and increases its flexibility, tackiness, and toughness. Kaolin
            clay is frequently added to raise the viscosity and prevent excessive
            penetration into porous substrates. Sodium silicate adhesives are very
            resistant to high temperatures. Some can resist up to 2,000 F. Their
            main use is to bond porous substrates such as paper and cardboard
            where an inexpensive, fast processing adhesive is required. Other ap-
            plications for silicates include wood bonding, adhering glass to porous
            substrates, glass fiber insulation bonding, fabrication of foundry
            molds, and abrasive wheel cements.

              10.4.3.2.2  Phosphate cements. These cements are based on the reaction
            products of phosphoric acid with other materials such as sodium sili-
            cate, metal oxides and hydroxides, and the salts of basic elements.
            Zinc phosphate is one of the most important metal phosphate cements
            and is used as a dental adhesive. Metallic phosphates of aluminum,
            magnesium, chromium, and zirconium develop excellent thermal sta-
            bility when heated to 570 F. They are virtually insoluble in hot water
            once fully set. Other applications are the bonding of refractory mate-
            rials.
              10.4.3.2.3  Litharge cement. Mixtures of glycerin and litharge (lead ox-
            ide) are used as adhesives in the repair of tubs and sinks, pipe valves,
            glass, stoneware, and common gas conduits. A mixture of one part
            slightly diluted glycerin with two to three parts of lead oxide requires
            approximately one day to form a crystalline compound. The resulting
            cement resists weak acids and nitric acid, but reacts with sulfuric acid.
            These materials have been used as ceramic seals in potting electronic
            equipment. They are not used much today because of the toxic effects
            of lead.
              10.4.3.2.4  Sulfur cement. Liquid sulfur (melting point 730 F) can re-
            ally be considered as an inorganic hot melt adhesive. However, this
            material should not be exposed at temperatures greater than 200 F
            because of a marked change in the coefficient of expansion at 205 F
            as a result of phase change. The addition of carbon black and poly-
            sulfides improves the physical properties of this adhesive. Adhesion to
            metals, particularly copper is good. Tensile strengths of about 580 psi
            are possible. The principal use of sulfur cement is for acid tank con-
            struction, where resistance to high temperature oxidizing acids are
            required.

            References
             1. Austin, J. E., and Jackson, L. C., ‘‘Management: Teach Your Engineers to Design
               Better with Adhesives’’, SAE J., October 1961.
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