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                   296                       MEMS and Microstructures in Aerospace Applications


                   each mission to provide a contamination control plan (CCP), which defines the
                   comprehensive contamination control program that will be implemented in the
                   mission. Additionally, specific verification plans and requirements must be defined
                   in the CCP.
                       Regardless of contamination sensitivity, the implementation of the CCP needs
                   to be addressed in all mission phases in order to prevent any detrimental contam-
                   ination damage. Among spacecraft systems, performance of optical and thermal
                   control is most vulnerable to contamination degradation. A high contamination
                   sensitivity mission is primarily one which relies on optical sensing, and imaging
                   or spacecraft or both, which require very strict temperature control, while a low
                   contamination sensitivity mission is generally one with very insensitive optics and
                   relatively flexible thermal control requirements. Highly sensitive missions usually
                   require design and implementation of a strict contamination control program ac-
                   companied with ongoing monitoring and cleaning procedures.
                       Table 13.1 describes top-level contamination requirements of high contamin-
                   ation-sensitive hardware in a conventional mission. As hardware dimensions
                   decrease due to spacecraft miniaturization, surface cleanliness levels become
                   increasingly significant. Micrometer-sized particles of lesser impact on conven-
                   tional spacecraft become extremely critical for miniaturized spacecraft.

                   13.6.2 MEMS CONTAMINATION CONTROL
                   The contamination effect on MEMS devices is enhanced by the relative dimensions
                   between contaminants and MEMS devices. Because MEMS devices may contain
                   exposed moving parts, they do not function well in the presence of liquid, vapor,
                   particles, or other contaminants. A contamination assessment needs to be made
                   early in the program to determine whether the possibility exists that the MEMS
                   devices will be unacceptably degraded by molecular or particulate contaminants, or
                   if it will be a source of contaminants itself. This preliminary assessment can be
                   achieved by carefully examining mission-specific environments and contamination
                   sources are shown in Table 13.2. The assessment should take into account all the
                   various factors during the entire mission phases including selection of materials



                   TABLE 13.1
                   Contamination Requirements for a High Contamination Sensitive Mission

                   Requirement Category                             Quantitative Level
                   Clean room needed (when optics are exposed)  Class 100 per FED-STD-209
                   Clean room needed (other operations)        Class 10,000 per FED-STD-209
                   Optics allowable molecular (EOL)            <100 A ˚
                   Nonoptics allowable molecular (EOL)          Level A per MIL-STD-1246
                   Optics allowable particulate (EOL)          <Level 100 per MIL-STD-1246
                   Nonoptics allowable particulate (EOL)       Level 200–300 per MIL-STD-1246






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