Page 142 - The Art of Designing Embedded Systems
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Hardware Musings  129


                         PALS, FPGAs, and PLDs all ease this process to some extent. Many
                    changes are not much more difficult than editing and recompiling a file. It
                    is important to have the right tools available: your frustration level will
                    skyrocket if the PAL burner is not right at the bench.
                         FPGAs that are programmed at boot time via a ROM download usu-
                    ally have a debugging mechanism-a  serial connection from the device to
                    your PC, so you can develop the logic in a manner analogous to using a
                    ROM emulator. Be sure to put the special connector on your design, and
                    buy the little adapter and cable. Burning ROMs on each iteration is a ter-
                    rible waste of time.
                         PLDs often come like EPROMs, in ceramic packages with quartz
                    erasure windows. These are great. . . if you were clever enough either to
                    socket the parts, or to have left room around the part for a socket.
                         On through-hole designs I generally have the technicians load sock-
                    ets for every part on the prototype. I want to replace suspected failed de-
                    vices quickly, without spending a lot of time agonizing over “Is it really
                    dead?’
                         Sockets also greatly ease making circuit modification. With an  8-
                    layer board it’s awfully hard to know where to cut a track that snakes be-
                    tween  layers and under components. Instead,  remove  the pin  from the
                    socket and wire directly to it.
                         You can’t lift pins on programmable parts, as the device programmer
                    needs all of them inserted when reburning the equations. Instead, stack
                    sockets. Insert a spare socket between the part and the socket soldered on
                    the board. Bend the pins up on this one. All too often the metal on the
                    upper socket will, despite the bent-out pin, still short to the socket on the
                    bottom.  Squish the metal in the bottom  socket down into the plastic to
                    eliminate this hard-to-find problem.
                         Surface-mount parts are much more problematic. Get a good set of
                    dental tools  and a very  fine soldering  iron,  so you can pry  up pins as
                    needed. You’ll need a bright light with magnifier, a steady hand, and ab-
                    stinence from coffee. A decent surface-mount rework machine (such as
                    from Pace Electronics) is essential; get one that vectors hot air around the
                    IC’s pins. Don’t even try to use conventional solder on fine-pitch parts; use
                    solder paste instead, and keep it fresh (usually it’s best stored in a fridge).
                         Since SMT is so tough, I always make prototype boards with tracks
                    on the outer layers. Sure, the final version might reverse this (power and
                    ground  outside  to  reduce  emissions),  but  reverse  the  layering  during
                    debug. It’s easy to cut tracks with an X-Acto knife.
                         Every engineer needs at least two X-Acto knives. One is for finger-
                    nail cleaning, cutting open envelopes, and tossing at the dartboard. The
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