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62                                      Chapter 2  Structure and Deformation in Materials


               In metals, the defects that lower the strength are primarily dislocations. These move under
            the influence of applied stresses and cause yielding behavior. In large single crystals containing
            a few dislocations, yielding occurs at very low stresses that are lower than the theoretical value by a
            factor of 300 or more. Strengths are increased above this value if there are obstacles to dislocation
            motion, such as grain boundaries, hard second-phase particles, alloying elements, and dislocation
            entanglements. The resulting strength for engineering metals in bulk form may be as high as one-
            tenth of the theoretical value of E/10, that is, around E/100.
               Materials are also subject to time-dependent deformation called creep. Such deformation is
            especially likely at temperatures approaching melting. Physical mechanisms vary with material and
            temperature. Examples include diffusion of vacancies in metals and ceramics and sliding of chain
            molecules in polymers.
               The necessarily brief treatment given in this chapter on structure and deformation in materials
            represents only a minimal introduction to the topic. More detail is given in a number of excellent
            books, a few of which are listed as references at the end of this chapter.





                                  NEW TERMS AND SYMBOLS

            body-centered cubic (BCC) structure      melting temperature, T m
            close-packed planes, directions          metallic bond
            covalent bond                            polycrystalline material
            diamond cubic structure                  screw dislocation
            edge dislocation                         secondary (hydrogen) bond
            face-centered cubic (FCC) structure      slip plane
            glass transition temperature, T g        slip step
            grain boundary                           substitutional impurity
            hexagonal close-packed (HCP) structure   theoretical cohesive strength, σ b ≈ E/10
            interstitial                             theoretical shear strength, τ b ≈ G/10
            ionic bond                               unit cell
            lattice plane; lattice site              vacancy





                                            REFERENCES

            CALLISTER, W. D., Jr., and D. G. RETHWISCH. 2010. Materials Science and Engineering: An Introduction,
              8th ed., John Wiley, Hoboken, NJ.
            COURTNEY, T. H. 2000. Mechanical Behavior of Materials, McGraw-Hill, New York.
            DAVIS, J. R., ed. 1998. Metals Handbook: Desk Edition, 2d ed., ASM International, Materials Park, OH.
            HAYDEN,H.W., W. G. MOFFATT,and J. WULFF. 1965. The Structure and Properties of Materials, Vol. III:
              Mechanical Behavior, John Wiley, New York.
            HOSFORD, W. H. 2010. Mechanical Behavior of Materials, 2nd ed., Cambridge University Press, New York.
            KELLY,A., andN.H. MACMILLAN. 1986. Strong Solids, 3d ed., Clarendon Press, Oxford, UK.
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