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               Tuntiwaranuruk, U., Thepa, S., Tia, S., and Bhumiratana, S. 2006. Modeling of soil
                  temperature and moisture with and without rice husks in an agriculture green-
                  house. Renewable Energy. 31(12):1934–1949.
               Usowicz, B., Lipiec, J., and Ferrero, A. 2006. Prediction of soil thermal conductiv-
                  ity based on penetration resistance and water content or air-filled porosity.
                  International Journal of Heat and Mass Transfer. 49(25–26):5010–5017.
               van de Braak, N. J., Kempkes, F. L. K., Bakker, J. C., and Breuer, J. J. G. 1998.
                  Application of simulation models to optimise the control of thermal screens.
                  Acta Horticulturae. 456:391–398.
               van Donk, S. J., Tollner, E. W., Steiner, J. L., and Evett, S. R. 2004. Soil tempera-
                  ture under a dormant bermudagrass mulch: Simulation and measurement.
                  Transactions of the American Society of Agricultural Engineers. 47(1):91–98.
               van Rooyen, M. and Winterkorn, H. F. 1959. Structural and textural influences on
                  thermal conductivity of soils. Proceedings of the 38th Annual Meeting of the Highway
                  Research Board. Washington DC: National Highway Research Board:576–621.
               Villalobos, F. J., Mateos, L., and Ferreres, E. 2002. Fitotecnia. Bases y tec–logías de la
                  producción agrícola. Madrid: Ed. Mundi–Prensa. 496.
               Vinocur, M. G. and Ritchie, J. T. 2001. Maize leaf development biases caused by
                  air–apex temperature differences. Agronomy Journal. 93(4):767–772.
               Washitani, I. 1985. Germination rate depending on temperature of Geranium caro-
                  linium seeds. Journal of Experimental Botany. 36(163):330–337.
               Washitani, I. and Saeki, T. 1986. Germination responses of Pinus densiflora seeds to
                  temperature light and interrupted imbibition. Journal of Experimental Botany.
                  37(182):1376–1397.
               Weber, S., Graf, A., and Heusinkveld, B. G. 2007. Accuracy of soil heat flux plate
                  measurements in coarse substrates—Field measurements versus a laboratory
                  test. Theories of Applied Climatology. 89(1–2):109–114.
               Wierenga, P. J., Nielsen, D. R., and Hagan, R. M. 1969. Thermal properties of a soil
                  based upon field and laboratory measurements. Soil Science Society of America
                  Journal. 33(3):354–561.
               Wierenga, P. G. and de Wit, C. T. 1970. Simulation of heat transfer in soils. Soil
                  Science Society of America Journal. 34:845–848.
               Wiltshire, R. J. 1983. Periodic heat conduction in a non-uniform soil. Earth Surface
                  Processes and Landforms. 8(6):547–555.
               Wu, H. J., Wang, S. W., and Zhu, D. S. 2007. Modelling and evaluation of cool-
                  ing capacity of earth-air-pipe systems. Energy Conversion and Management.
                  48(5):1462–1471.
               Yadav, M. R. and Saxena, G. S. 1973. Effect of compaction and moisture content on
                  specific heat and thermal capacity of soils. Journal of the Indian Society of Soil
                  Science. 21:129–132.
               Zeroni, M., Nir, A., and Kopel, R. 1984. Root zone heating as an element in
                  energy conservation in a seasonal heat storage greenhouse Acta Horticulturae.
                  148:859–864.
               Zhang, H. F., Ge, X. S., Ye, H., and Jiao, D. S. 2007. Heat conduction and heat storage
                  characteristics of soils. Applied Thermal Engineering. 27:369–373.
               Zhang, Y., Wang, S., Baff, A. G., and Black, T. A. 2008. Impact of snow cover on soil
                  temperature and its simulation in a boreal aspen forest. Cold Regions Science
                  and Technology. 52(3):355–370.
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