Page 118 - Building A Succesful Board-Test Strategy
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104 BUILDING A SUCCESSFUL BOARD-TEST STRATEGY
After the reflow oven, inspection performs a final check of solder-joint geom-
etry, solder-joint integrity, and any component movement while the board is in the
oven. Realizing that few manufacturers inspect both pre- and post-reflow, this step
also looks for component existence and position, component identification (subject
to the same caveat as above), trace existence, and trace defects such as
"mousebites." Figures 3-6 through 3-11 show some common failure types.
Figure 3-6 These two photographs show boards containing missing-component faults.
(Photos courtesy Teradyne.)
