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              Metalorganic Chemical Vapor Deposition                                                      509

              to grow IVA–VIA compounds by MOCVD in 1975. Since   Another important class of oxides that have been grown
              this time, the MOCVD process has been used to grow thin  by MOCVD are the ferroelectrics, including PbTiO 3 ,
              films of many of these alloys. The precursors employed are  BaTiO 3 , PbLaZrTiO 3 , and PbZr 1−x Ti x O 3 . This work is
              typically tetraethyllead (TEPb), TESn, and H 2 Te. How-  still in its infancy, however, promising results have been
              ever, most work in this area has been halted since these  achieved. Further studies of the relationship between film
              materials are somewhat unstable and other semiconductor  properties, the mechanism of deposition, growth parame-
              compounds can cover the same spectral region.     ters, and the choice of precursors are necessary to discover
                                                                an optimized MOCVD process for this class of impor-
                                                                tant ferroelectrics thin films which will be of great use
              B. II–VI Semiconductor Compounds
                                                                in the next generation of deep-submicron Si device design
              The semiconductors composed of elements in Columns  and manufacture. Another dielectric material that has been
              IIB and VIA consist of materials covering the “wide-  grown by MOCVD is ZnO.
              bandgap” region and the “narrow-bandgap” compound
              semiconductors. The wide-bandgap materials are those
                                                                D. Deposition of Metals by MOCVD
              in the ZnMgSSe/ZnCdSSe systems. The wide-bandgap
              II–VI compounds in the Zn x Cd 1−x S y Se 1−y /Zn x Mg 1−x S y  An important new application for MOCVD is the deposi-
              Se 1−y system have been grown by MOCVD. The       tion of pure metal films for semiconductor integrated cir-
              commonly used sources are DEZn, dimethylsele-     cuit applications. Important metals deposited by MOCVD
              nium (DMSe), ditertiarybutylselenide (DTBSe), DMCd,  include Al, Cu, CuAl alloys, and W films using pre-
              bismethyl-cyclopendadienyl-magnesium [(MeCp) 2 Mg],  cursors  listed  in  Table  I.  It  is  expected  that  this  ap-
              diethyl sulfide (DES), and H 2 S. These materials are use-  plication area for MOCVD will expand rapidly in the
              ful for visible LEDs and laser diodes. However, to date,  next few years as the demand increases for high-density
              difficulties in the MOCVD growth of high-conductivity  metal interconnects for Si integrated circuit technology.
              p-type materials in this system has prevented the demon-  High-purity Al metal films have also been grown by
              stration of LEDs with characteristics comparable to those  MOCVD.
              fabricated from MBE-grown materials.
                The most important IIB–VIA narrow-gap materials
              are in the HgCdZnTe quaternary system, with the ternary  V. OTHER DEVELOPMENTS IN MOCVD
              Hg x Cd 1−x Te (MCT) being the most commonly used for
              photodetectors in the 8–12 µm regime. The narrow-gap  The limitations of space and the specific subject of this ar-
              materials can be grown by MOCVD using elemental   ticle have prevented me from describing many of the other
              Hg, dimethylmercury (DMHg), diethyltelluride (DETe),  importantdevelopmentsleadingtothebreadthandsuccess
              methylallyltelluride  (MATe),  diisopropyltelluride  of the current MOCVD technology. An important devel-
              (DIPTe), dimethylcadmium (DMCd), and dimethylz-   opment mentioned above is the use of advanced chemi-
              inc (DMZn). These semiconductors are all low-     cal kinetics, surface kinetics, and hydrodynamics models
              melting-point materials and are typically grown in the  that can provide for full three-dimensional solutions to
              350 C ≤ T g ≤ 450 C range. Recently, the RDR multiple-  the multifaceted boundary conditions occurring in a CVD
                            ◦
                 ◦
              wafer reactor geometry has been adapted to provide  system. The Sandia National Laboratories (USA) CVD
              for large-area growth of uniform layers in the HgCdTe  Sciences Group, particularly M. E. Coltrin, has provided
              system.                                           tools for the detailed analysis of MOCVD systems, and
                                                                they have contributed greatly to the understanding of the
                                                                large-area commerical MOCVD reactors in common use
              C. Growth of Oxides by MOCVD
                                                                today. These chemical process models have become com-
              A variety of oxides have been grown by MOCVD, in-  mercially available and are now offered by several compa-
              cluding the important class of high-temperature supercon-  nies. Using these models, important modifications to re-
              ducting Cu oxides. Particular attention has been given to  actor designs have been made that greatly improve growth
              the BiSrCaCuO and YBaCuO systems. Superconducting  efficiencies, material uniformity, interface abruptness, and
              metal oxide films grown by MOCVD have been limited in  materials quality. This is especially important for the
              performance largely by the relatively primitive state of the  design and optimization of very large-scale MOCVD re-
              novel precursors used for these materials, and by the need  actors, e.g., systems with capacities for seven 6.0 in. diam-
              to develop reactor designs compatible with the low vapor  eter wafers as shown in Figs. 6 and 7. In fact, these large-
              pressures of these materials, and the oxidizing nature of  scale reactors are difficult and expensive to build, even
              the growth ambient.                               in prototype form. Evaluating reactor designs through
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