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                               34. Onic, L., Bucur, V., Ansell, M. P., Pizzi, A., Deglise, X., and Merlin, A.,
                                   Dynamic Thermomechanical Analysis as a Control Technique for Thermoset
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                                37. Ludbrook, B. D., and Whitwood, R. J., The Use of Thermal Analysis to
                                   Investigate the Cure of Reactive Adhesives, Int. J. Adhesion Adhesives,
                                   12(3):138–144 (1992)
     	
