Page 227 - Handbook of Adhesion Promoters

220 Index

Coulomb interactions 39 Debye-van der Waals 19
coulombic energy 158 deep valleys 6
coupling deformation 158, 211
agent 15, 32, 36 degradation 211
technology 123 degreasing 57
covalent delamination 10, 14, 27, 46-50, 147, 185,
bond 28, 31 211
formation 62 polymer weathering effect 49
bonding 5, 16, 62 rate 46
chemical bond 168 steps 47
linkage 213 deleterious substances 212
crack 6, 48 dendritic
plane 34 oligomer 139
propagation 177 polymer 123
craters 6 dental 38, 72, 82
creep 51 adhesion promoter 83, 192
resistance 93 composite 94
critical implant 39, 192
debonding 49 material 178
driving energy 143 polymer 17
relative humidity 37, 50 resin 147
surface tension 84 dentin 94, 192
threshold concentration 212 depilatory wax 191
crosslinking 173 deposition process 27
degree 212 detachment 49
reaction 154, 158 diamond 61
crystal nuclei 22 bur 192
crystalline paste 60
growth 22 dicyclopentadiene 35
properties 5, 6, 22 dielectric
crystallization 22-23 barrier discharge 61
crystallographic constant 171
bonding 24 resin 73
relationship 24 diene elastomer 208
curing 211 diffusion 5-6, 13, 62, 174, 181
cyclodextrin 94 activation energy 13
cytoplasmic projection 41 coefficient 37, 213
rate 46
D time 14, 37
damage mechanism 10 type 213
dangling chain 98 diffusivity parameter 37
de-adhesion process 177 digital
debonding 32, 49, 169, 188 microfluidic chip 26, 196
energy dissipation 98 printing 156
growth rate mechanism 49 dimethylaminoethanol 156, 175