Page 228 - Handbook of Adhesion Promoters

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dimethylnorbornene ester 35 electrochromic device 33
dip coating 162, 188 electrode 33
dipole-dipole interaction 93 electrodeposited metal film 27
direct printing 145 electro-galvanized steel 185
dirt particles 12 electroless
disaccharide 205 copper deposition 140
discharge plasma 98 plating 74
dispersion 18, 151 electrolyte 46
forces 19 cation 46
dispersive component 19 electron acceptor 17
dissolution 6 beam lithography 72
DLVO theory 39 donor 17
domestic appliances 66 character 142
donor number 16 electronic
double device 27, 62
cantilever beam joint 10 packaging devices 52
dip system 154 electronics 38, 97, 196
drag 179 industry 26
Drago equation 16 manufacturing 196
drying 212 electrophoretic mobility, 39
step 14, 156 electrostatic
temperature 158 attraction 18, 94
DSC 35 attraction theory 17
Dupré’s equation 19 charge 205
dust 64 force 5, 18
particle 179, 211 interaction 6, 16-18, 39, 62, 192
repulsion 142
E elemental analysis 59
effective surface area 64 emery 61
elastic enamel surface 192
energy release 9 encapsulation 151
recovery 36 energetic effort 40
electric energy
cable 66 dispersive
discharge machining 68 spectroscopy 65
double layer interaction 39 x-ray imaging 175
field 18 release rate 53
electrical entanglement 6, 13-14, 84, 156
conductivity 145, 151 network 13-14
double layer 17 environmental
insulation 48 exposure 48
electrochemical factor 48, 211
activity 58 stress 48
behavior 213 stressor 58
impedance spectroscopy 48, 213 environmentally friendly manner 62