Page 327 - Handbook of Adhesives and Sealants
P. 327

Activation and Curing Requirements  Remarks  used  Forms available  bond usually increase  will Applying heat  all Formulated in available; 250 to  types  temp  room adhesi











            Adhesives Classified by  Types  450 F types  to  temp  Room  common  most 350 F types  adhesives  lb/in. 2 types  500  to  Contact  most lb/in. 2 types  adhesives  few requi







            TABLE 8.2  Requirement  .......  Heat  Pressure....  .......  Time  Catalyst ....  288
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