Page 367 - Handbook of Adhesives and Sealants
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Adhesive Composition and Formulation  323


            TABLE 9.1 Fillers for Common Epoxy Adhesive
            Formulations 2
                   Filler         Improvement in epoxy adhesive
            Aluminum              Machinability, impact resistance
            Alumina               Abrasion resistance, electrical
            Aluminum silicate     Extender
            Aluminum trioxide     Flame retardant
            Asbestos fibers        Reinforcement
            Barium sulfate        Extender
            Calcium carbonate     Extender
            Calcium sulfate       Extender
            Carbon black          Color, reinforcement
            Copper                Machinability, elec conductivity
            Glass fibers           Reinforcement
            Graphite              Lubricity
            Iron                  Abrasion resistance
            Kaolin clay           Extender
            Lead                  Radiation shielding
            Mica                  Electrical resistance
            Phenolic microspheres  Decrease density
            Silica sand           Abrasion, electrical properties
            Silicon carbide       Abrasion resistance
            Silver                Electrical conductivity
            Titanium dioxide      Color
            Zinc                  Adhesion, corrosion resistance
            Zirconium silicate    Arc resistance



            be changed significantly. Thermal expansion, electrical and thermal
            conduction, shrinkage, viscosity, and thermal resistance are only a few
            properties that can be modified by use of fillers. Common fillers are
            wood flour, silica, alumina, titanium oxide, metal powders, china clay
            and earth, slate dust, and glass fibers. Some fillers may act as ex-
            tenders.
              A carrier or reinforcement is usually a thin fabric, cloth, or paper
            used to support the semicured adhesive composition to provide a tape
            or film. In pressure sensitive tapes, the carrier is the backing on which
            the adhesive is applied. The backing may be used for functional or
            decorative purposes. In films or structural tape, the carrier is usually
            porous and the adhesive saturates the carrier. Glass, polyester, and
            nylon fabric are common carriers for supported B-staged adhesive
            films. In these cases, the carrier provides a method of applying the
            adhesive and also acts as reinforcement and an internal ‘‘shim’’ to
            control the final thickness of the adhesive.
              Plasticizers are incorporated into an adhesive formulation to provide
            flexibility and/or elongation. Plasticizers may also reduce the melt vis-
            cosity of hot melt adhesives. Similar to diluents, plasticizers are non-
            volatile solvents for the base resin. By being incorporated into the
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