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Adhesive Composition and Formulation 341

ence proceedings, and other texts, which describe adhesive formula-
tions for specific applications. Often the user can try to employ an
adhesive that was successfully developed for an application that has
many of the same requirements as the current application. Valuable
information can also be gained from the raw materials suppliers. They
often develop adhesive formulations using their materials and freely
offer these to both the adhesive suppliers and to the general public.
Often these formulations become the basis of commercially available
systems.

References
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neered Materials Handbook, ASM International, 1990.
2. Materials Engineering, May 1976, at 73.
3. Pocius, A. V., Adhesion and Adhesives Technology, Chapter 9, ‘‘The Chemistry and
Physical Properties of Elastomer-Based Adhesives’’ (New York: Hanser Publishers,
1997).
4. Goulding, T. M., ‘‘Pressure Sensitive Adhesives’’, in Handbook of Adhesive Technol-
ogy, Pizzi, A. and Mittal, K. L., eds. (New York: Marcel Dekker, 1994).
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Reinhold Publishing, 1990).
6. Satas, D., ed., The Handbook of Pressure Sensitive Adhesives, 2nd edition, (New
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Ridge, NJ: Noyes Publications, 1984).
8. Ash, M., and Ash, I., eds., Formulary of Adhesives and Sealants, (New York: Chem-
ical Publishing Co., 1987).
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Adhesives and Sealants’’, Adhesives Age, July 1995.
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ufacturing, G. L. Schneberger, ed. (New York: Marcel Dekker, 1983).
11. Siebert, A. R., et al., ‘‘CTBN Modified Epoxies Work in Poor Bonding Conditions’’,
Adhesives Age, July 1986.
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Plastics’’, Adhesives Age, July 1985.
13. Lee, H., and Nevel, K., Epoxy Resins, Their Applications and Technology (New York:
McGraw-Hill, 1957) at 151.
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16. Sadhir, R. K., and Luck, R. M., Expanding Monomers: Synthesis, Characterization,
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17. Schlademan, J. A., Handbook of Pressure Sensitive Adhesive Technology, 2nd ed.,
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Age, September 1999.
20. Bolger, J. C., and Morano, S. L., ‘‘Conductive Adhesives: How and Why They Work’’,
Adhesives Age, June 1984.
21. Problem Analysis Form, National Starch Corp. Bulletin.