Page 438 - Handbook of Adhesives and Sealants
P. 438

Curing  Applications Properties conditions  bonding composite  and  Metal  400F  at properties  Good  350F  @  hr  2  splicing, edge  core Aerospace density  Low  350F  @  4hr
      Temperature Adhesives  Form  Paste  Foaming,  unsupported  film  paste  pt  Supported film  Supported film  Supported film  Solution  Solution  Solution






      Selected High  Adhesive  supplier  1  Electronics  Technology




      Suppliers of  Ciba-Giegy  Cytec  Dexter  Dexter  Cytec  Cytec  BLH  Epoxy  Furane



      TABLE 10.14  Adhesive  tradename  Bismaleimide  326  Redux  Metlbond  6604-1  9369  EA  9673  EA  Polyimide  57  FM  55  FM  PLD-700  390 Epotek  7501  379
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