Page 439 - Handbook of Adhesives and Sealants
P. 439

bonding  splicing, edge  filing

          Applications  composite  core  honeycomb  edge  construction  and  metals  repairs  and  metals  attachment  attachment  attachment


             and  of  and  Honeycomb  composites,  composites  gauge
             Metal  Aerospace  sealing  Potting  Aerospace  Aerospace  Strain  Electronic  Electronic


                       400F    500F
             400F  to  at      at  temperature
          Properties  at properties  density  transparent  Structural properties  outgassing  Continuous service  resistant  Condensation cured  transparent  Continuous service  transi



             Good  Low  Radar  450F  No  Moisture  Radar  Addition cure  Glass  over  Thin  Thin  Thin



        Curing  conditions  350F  @  hr  2  350F  @  4hr  350F  @  min  60  350F  @  min  60  350F  @  min  90  350F  @  hr  2  500F  @  hr  2  400F  @  min  60  320F  @  min  5


      Temperature Adhesives  Form  Paste  Foaming,  unsupported  film  paste  pt  Supported film  Supported film  Supported film  Solution  Solution  Solution






      Selected High  Adhesive  supplier  1  Electronics  Technology




      Suppliers of  Ciba-Giegy  Cytec  Dexter  Dexter  Cytec  Cytec  BLH  Epoxy  Furane



      TABLE 10.14  Adhesive  tradename  Bismaleimide  326  Redux  Metlbond  6604-1  9369  EA  9673  EA  Polyimide  57  FM  55  FM  PLD-700  390 Epotek  7501


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