Page 513 - Handbook of Adhesives and Sealants
P. 513

Bonding  pressure  not  required  X  X  X  X  X  X  X
     Processing conditions  Bonding  pressure Elevated  required  temp  ...  ...  X*  X*  ...  ...  X  X  X  X  X  X  X  X  X  ...  X  X  X  ...  X  ...  X  X*  ...  ...  ...  ...  ...




         Room  temp  X  X  X  ...  X  ...  X  X  X  X  X  X  X  X  X  ...  X  ...  X  ...  ...  ...  ...  ...
         Chemical  reaction  ...  ...  ...  ...  ...  ...  ...  ...  X  ...  ...  ...  X  ...  X  ...  ...  ...  X  ...  X  ...  X  ...  X  ...  X  ...  X  ...  X  ...  X  ...  X  ...


   Continued  Method of cure  Fusion Solvent  Pressure-  on Solvent  sol,  sensitive heating  release emulsion  ...  X  X  X*  X  X  ...  X  X  X  ...  ...  ...  X  X  X  ...  ...  X



   Selecting Adhesives with Respect to Form and Processing Factors  Common forms available  Liquid  Paste  Film  Solid  ...  ...  ...  ... .................  ...  ...  X  X  ...  ...


















   TABLE 11.5  Adhesive type  Vinyl vinylidene Polyvinyl acetal .................. Polyvinyl alcohol ................. Polyamide ....................... Acrylic .......................
                                35.
                                 36.
                                    37.
                            32.
                             33.
                              34.
                                        41.
                                          42.
                                           43.
                                     38.
                                      39.
                                       40.
                23.
                 24.
                  25.
            20.
             21.
               22.
                         29.
                          30.
                           31.
                     26.
                      27.
                       28.
                                             443
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