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                   218                       MEMS and Microstructures in Aerospace Applications


                       Excitation of the microgyro dynamics is achieved by applying a potential to the
                   two drive electrodes. The drive electrodes and sense electrodes are suspended by
                   silicon springs above matching electrodes on the base plate. The post adds inertia to
                   the system which boosts the sensitivity to rotational motion. The electrical potential
                   between the drive electrodes and their respective base plate electrodes creates an
                   electrostatic force that, ideally, rocks the cloverleaf assembly about the y-axis. The
                   amplitude of the rocking motion can be maximized by driving the electrodes at the
                   natural frequency of this DoF, known as the drive mode. If the device is rotated
                   about the z-axis, then the rocking about the y-axis is coupled into rocking about the
                   x-axis via Coriolis acceleration in the x–y frame fixed to the gyro. The rocking
                   about the x-axis is referred to as the sense mode and the x-axis response is related to
                   the angular rate of rotation about z. The operating principles of the PRG microgyro,
                   fabrication details, and preliminary performance results have been extensively
                   documented.
                       Other gyroscopes, such as the ones designed by BEI Sensor and Systems
                   Company, use tuning fork designs, where the result of the Coriolis force is a
                   vibration mode orthogonal to the standard in plane tuning fork mode. 30,37
                       Also, as previously discussed, the Draper Laboratory MEMS TFG design
                   has been optimized for infusion in the NASA NMP ST6 ISC flight hardware.
                   Similar to the JPL PRG, the principle of operation for the Draper Laboratory
                   MEMS TFG is fundamentally based upon the Coriolis force. The resonant structure
                   is composed of two proof masses which are each driven electrostatically with
                   opposite oscillatory phases. Alternating voltages applied to the outer motor drive
                   electrodes create electrostatic forces between the interlocking tines of the motor
                   electrode and proof mass, which results in lateral (in the plane of the wafer)
                   oscillatory motion. The proof masses are driven in a tuning-fork resonance mode.
                   In response to an angular rate, V, being applied about the input axis, perpendicular
                   to the velocity vector of the masses, a Coriolis acceleration is produced which
                   forces the masses to translate in and out of the plane of oscillation. This resultant
                   antiparallel, out-of-plane motion is measured via the capacitive pick-off, providing
                   an output signal proportional to the rate input. Closed-loop control is employed to
                   maintain the proof mass at constant amplitude and the rate sensing is conducted in
                   an open loop manner.
                       The successful operation of this device depends on the electronics that controls
                   the mechanism motion and senses the rate output. Each gyro axis requires an analog
                   ASIC and a supporting field programmable gate array (FPGA), both on ball grid
                   arrays. The gyro electronics requires only power and needs no direction from the
                   microprocessor board except for requests for information. Gyro rate information
                   is currently sampled at a fixed rate of 600 Hz, and the resultant information is
                   communicated digitally through a low-voltage differential signaling (LVDS) inter-
                   face to the microprocessor. The gyro electronics and the packaged gyro sensors are
                   placed on printed wiring boards and can be assembled by standard pick and place
                   assembly equipment.







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