Page 17 - Manufacturing Engineering and Technology - Kalpakjian, Serope : Schmid, Steven R.

28.3 Semiconductors and Silicon 794
28.4 Crystal Growing and Wafer Preparation 795
28.5 Film Deposition 798
28.6 Oxidation 799
28.7 Lithography 800
28.8 Etching 808
28.9 Diffusion and Ion Implantation 816
28.10 Metallization and Testing 818
28.11 Wire Bonding and Packaging 820
28.12 Yield and Reliability 825
28.13 Printed Circuit Boards 826
Summary 827 Key Terms 828 Bibliography 828
Review Questions 829 Qualitative Problems 829
Quantitative Problems 830 Synthesis, Design, and Projects 830

29 Fabrication of Microelectromechanical Devices
and Systems and Nanoscale Manufacturing 831

29.1 Introduction 831
29.2 Micromachining of MEMS Devices 833
29.3 The LIGA Microfabrication Process 844
29.4 Solid Free-form Fabrication of Devices 850
29.5 Nanoscale Manufacturing 855
Summary 858 Key Terms 858 Bibliography 858
Review Questions 859 Qualitative Problems 859
Quantitative Problems 860 Synthesis, Design, and Projects 860

Part VI: joining Processes and

Equipment 861

30 Fusion-Welding Processes 865

30.1 Introduction 865
30.2 Oxyfuel-gas Welding 866
30.3 Arc-Welding Processes: Nonconsumable Electrode 869
30.4 Arc-welding Processes: Consumable Electrode 873
30.5 Electrodes for Arc Welding 879
30.6 Electron-beam Welding 880
30.7 Laser-beam Welding 880
30.8 Cutting 882
30.9 The Weld joint, Quality, and Testing 884
30.10 Joint Design and Process Selection 893
Summary 897 Key Terms 897 Bibliography 898
Review Questions 898 Qualitative Problems 898
Quantitative Problems 899 Synthesis, Design, and Projects 899

XXIX