Page 17 - An Introduction to Microelectromechanical Systems Engineering

xvi Preface

application and on the system that includes the MEMS product. We also expanded
the material in Chapter 8 on packaging to include packaging of optical MEMS prod-
ucts and added an entirely new section on reliability and quality assurance. We
added several references to each chapter to direct the advanced reader to the source
of the material. We also expanded the glossary to assist the novice in understanding
and relating to a new terminology.
Many people provided us technical information and materials specifically for
the second edition of this book. We thank Bardia Pezeshki of Santur Corporation;
John (Hal) Jerman of Iolon; Asif Godil of Lightconnect; Greg Ortiz of Surface Tech-
nology Systems; Bonnie Gray; Greg Jepson of Bullen Ultrasonics; Chris Bang and
Den Feinberg of Microfabrica; Malcom Gower of Exitech; Amy Wang; Brian Paegel
of The Scripps Research Institute; Carol Schembri and John Larson of Agilent Tech-
nologies; Didier Lacroix and Ken Cioffi of Discera; Michael Cohn of MicroAssem-
bly; Nelson Fuller of Alumina Micro; and Stephen Durant and Christopher Eide of
Morrison and Foerster. Evan Green and Carter Hand of New Focus were kind
enough to review portions of the manuscript. Thanks go to our editor, Mark Walsh,
for his unwavering support. Kirt Williams further thanks his former graduate advi-
sor, Professor Richard S. Muller, for having such a profound effect on his life for
introducing him to MEMS.