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2.2 / DESIGNING FOR PERFORMANCE 43

                                                                          Hyperthreading
                                                                             (multicore)
                10,000
                                                               Longer pipeline,
                                                                 double-speed
                             Improvements in
                             chip architecture                     arithmetic
                             Increases in                   Full-speed
                             clock speed                  2-level cache
                 1,000                      Speculative extensions
             Theoretical maximum performance (million operations per second)  100  instructions out-of-order  733 MHz  2000 MHz
                                                       MMX
                                                    multimedia
                                                                                 3060 MHz
                                             execution
                                      Multiple
                                     per cycle
                              Internal

                                cache
                     Instruction  memory             200 MHz  300 MHz
                       pipeline
                   10
                                             66 MHz
                                      50 MHz
                                  33 MHz
                             25 MHz
                      16 MHz

                    1
                       1988    1990    1992    1994    1996    1998    2000   2002    2004
            Figure 2.12 Intel Microprocessor Performance [GIBB04]




                       on high-density, high-speed chips is becoming a serious design issue ([GIBB04],
                       [BORK03]).
                     • RC delay: The speed at which electrons can flow on a chip between transis-
                       tors is limited by the resistance and capacitance of the metal wires connecting
                       them; specifically, delay increases as the RC product increases. As compo-
                       nents on the chip decrease in size, the wire interconnects become thinner, in-
                       creasing resistance.Also, the wires are closer together, increasing capacitance.
                     • Memory latency: Memory speeds lag processor speeds, as previously discussed.
                       Thus, there will be more emphasis on organization and architectural ap-
                  proaches to improving performance. Figure 2.12 highlights the major changes that
                  have been made over the years to increase the parallelism and therefore the
                  computational efficiency of processors. These techniques are discussed in later
                  chapters of the book.
                       Beginning in the late 1980s, and continuing for about 15 years, two main strate-
                  gies have been used to increase performance beyond what can be achieved simply
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