Page 243 - Design for Environment A Guide to Sustainable Product Development
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220    C h apter  Ele v e n

                   Most electronics companies have taken steps to embed DFE prac-
               tices such as Design for Disassembly into their new product devel-
               opment processes. The next step has been shifting attention to the
               practices of their suppliers. Electronic supply chains are complex and
               difficult to manage, since many electronic components are manufac-
               tured in Asia or Latin America. In 2006, a global coalition of electronic
               industry companies entered into an unprecedented international col-
               laboration to develop a set of supplier expectations, known as the
               Electronic Industry Citizenship Code. The code provides comprehen-
               sive principles for management of environmental releases, workplace
               health and safety, labor practices, and business ethics, and is sup-
               ported by standardized supplier assessment and auditing procedures.
                   As shown in Figure 11.1, there are many opportunities for apply-
               ing DFE practices in the electronic product life cycle. The following
               are selected examples of innovative DFE initiatives in the electronics
               industry:
                    •  Motorola established a Green Design Project to develop and
                      implement standards, methods, and tools for environmentally
                      conscious product design. A customized software tool called
                      the Green Design Advisor was developed to help Motorola
                      engineers calculate the life-cycle environmental impact of a
                      product and compare the environmental performance of dif-
                      ferent materials and processes used to create a product [2].
                      The tool includes a parts and connectivity model for analyz-
                      ing the recyclability of devices, identifying design weak-
                      nesses and optimizing for end-of-life disassembly.
                    •  Dell’s packaging engineers are saving over 20,000 tons of
                      packaging material annually thanks to a dematerialization
                      program that resulted in reduction and elimination of corru-
                      gated, plastic foam, and wood materials. For example, Dell
                      implemented slip sheets (three-pound, 0.03-inch thick plastic
                      sheets) instead of wood pallets (which weighed 40 pounds
                      and were 5 inches tall) for inbound chassis products.
                    •  Panasonic developed a plasma display technology that cuts
                      energy consumption in half, while maintaining the same
                      brightness. The system uses new phosphors and cell design
                      technology for improved discharge, and new circuit and drive
                      technology to significantly reduce power loss. This double-
                      efficiency technology will form the base for next-generation
                      displays with thinner profiles, larger screens, brighter images,
                      higher definition, lower power consumption, and lower weight.
                    •  Intel’s Core™ 2 Duo processor uses 40% less energy to do 40%
                      more work than the previous Pentium processor. The total
                      energy savings from all the Core 2 Duo products in the mar-
                      ketplace is equivalent to taking millions of cars off the road.
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