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Effect of Gas Wettability on Capillaries CHAPTER 5                   177























              FIGURE 5.12
              Equipment evaluating micro displacement simulation.

              5.2.1.1.2   Preparing Templates
              Taking the primary motherboard as the base image, high-contrast and high-
              precision templates are made of photosensitive offset or photosensitive dry
              plates, using camera technology.

              5.2.1.1.3   Preparing Etched Glass Network Models
                 1. Washing and processing glass slides
                       The glass slide was washed with alcohol and distilled water succes-
                    sively and then placed on a chuck and baked at 100 C. It was soaked

                    in negative gel or positive gel liquid base (choosing negative gel or
                    positive gel depends on negativity or positivity of the motherboard)
                    for 30 minutes, before it was finally pulled out and placed on the
                    chuck at 90 C for 30 minutes.

                 2. Spin coating
                       Spin coating was conducted in a dark room. The baked glass slide
                    was placed on the spin coating machine and the rotation speed was
                    adjusted, based on the viscosity of the glue and indoor temperature, to
                    ensure the photosensitive glue is evenly coated on the glass slide.
                    Finally, the glass slide was placed in a light-proof aluminum specimen
                    box after spin coating.
                 3. Prebaking
                       Prebaking, namely, hard baking, was conducted in a dark room.
                    The chuck with the glass slide was placed in dark metal boxes after
                    spin coating and baked for 30 minutes at 90 C.

                 4. Photoetching
                       Photoetching was conducted in a dark room. The template was
                    fixed in the center of the photoetching machine, and the photoetching
                    time was adjusted. The glass adhesive film was stuck relatively tightly
                    to the motherboard adhesive film after spin coating, which indicates
                    that photoetching can be conducted.
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