Page 151 - Handbook of Adhesion Promoters

144 Selection of Adhesion Promoters for Different

but the lap-shear strength was decreased when the content of flexible epoxy was increased
6
in the epoxy system.
Polyallylamine spontaneously adsorbs to silica surfaces and it is a simple, easy-to-
apply, and reactive adhesion promoter for photoresist applications of SU 8 containing
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epoxy oligomers.
The adhesion between copper and epoxy resin in the printed circuit board can be
improved by aminoalkylthiol and dithiol self-assembly used as an adhesion promoter. 8
The formation of chemical bond Cu–S and N–epoxy is essential to increase the adhesion
8
strength between copper and the polymer (Figure 8.3).
The γ-glycidoxypropyltrimethoxysilane film followed the roughness of the substrate
9
and protected the damaged area. When the painted area was damaged, the incorporation
of silane in the paint or doped silane in the pretreatment enhanced paint performance in
9
these areas.
A water-based oligomer adhesion promoter material that promotes adhesion of paste
adhesives used for structural bonding of metal components contains glycidoxytriethoxysi-
10
lane. The adhesion promoter in conjunction with an ambiently cured paste adhesive min-
imizes fatigue crack propagation, thereby increasing the usable life of the metal substrate
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in the strength bearing applications.
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The novolak-type adhesion promoter is used in a fusion-bonded epoxy resin. The
coating composition provides improved adhesion at high temperature operating conditions
and improved resistance to damage by cathodic disbondment for pipe, rebar, and other
11
substrates.
A sulfur-containing alkoxysilane was used to enhance adhesion of the epoxy resin to
12
gold. The invention relates to methods for electrically connecting one electrical conduc-
12
tor to another when one or both of the electrical conductors have a gold surface.
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6 Kwon, Y; Choe, Y, Mol. Cryst. Liq. Cryst., 598, 47-53, 2014.
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10 Stephenson, RR; Blohowiak, K; Osborne, JH, US6770371, The Boeing Company, Aug. 3, 2004.
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