Page 286 - Inorganic Mass Spectrometry - Fundamentals and Applications
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            In  any  glow  discharge  device, there are  complex inte~elationships among  the  dis-
            charge  voltage,  current,  and pressure, In the case of using  a secondq cathode,
            these  dependencies  take  on  different  meanings  as redeposition  process is inte-
                                                    the
            gral to the success of the methodology,  whereas it is generally  thought of as  a  neg-
            ative  attribute in other CD implementations.  Simply  put,  these  parameters  must
                                                                           be
            balanced to achieve the fo~ation of a  metallic  overlayer of proper  thickness. Sec-
            ondary  issues come about  from  the  desire to achieve  rapid  plasma  stabilization,
            low  amounts of signal drift, and unifo~ sputter-erosion in the case of depth  pro-
            filing of insulators.  Figure ’7.4. illustrates the  importance of choosing  the  proper
            discharge  pressure  (presented here as  the  pressure in the inte~ediate chamber  be-
                                                                  of
            tween the ion  source  and  mass  analyzer)  through  temporal  profiles the  ion  sig-
            nals for the case of using  a  tantalum  mask for a  glass  sample  [21].  At  the  highest
            pressure  (curve  a),  extensive  redeposition is evidenced by the  steady  decrease  in
            Si+ intensity  over  time, The lowest  pressure  (curve b) effects far less  redeposition
            and so the  opposite  trend  is seen.  Finally, at a  moderate  pressure  (curve  c) the
            plasma is seen  to  reach  a  steady state in approximately 12 min.  Source  stability
            evaluated at this  set of conditions  using  a  NIST  reference  material  was  on order
                                                                      the
            of 6% RSD using  ion  beam  ratios  over  a  150-min  analysis  period. Van  Crielcen et
            al.  [22] also showed  that  variations  in  discharge  power  (voltage  and  current) at a
            single source  pressure  influence the extent of redeposition  (via  samplelmaslc  ion
            beam ratios),
                 The group  at  the  University of Antwerp  has  done  extensive  evaluations  of
            the  possible  scope of the  secondary  cathode  methodology  [23].  The  evaluations
            identified  a  number of other “electrical”  dependencies.  For  example,  the  conduc-
            tivity of the  analytical  sample  influences  the  required  voltage  and  current  to
                                                                          sus-
            tain  a  stable  discharge,  and  thus  the  interplay  with  source  pressure  to  achieve  a
            proper  level of redeposition.  This  disparity  was first evidenced  in  a  comparison  be-
            tween the analysis of bulk  nonconductors  (glass)  and  compacted oxides, Although
            both  sample forms can be grossly  classified  as  “nonconductors”, differences in ab-
            solute  resistivity do affect perfo~ance, As is well  known  throughout the GI) lit-
            erature [521, the applied  potential also plays  a  key role in the evolution  of the sput-
            tered  crater.  As such,  there  may exist trade-offs between  the  discharge  conditions
            that produce the desired  analyte signal qualities  and  those for obt~nin~ adequate
            depth  resolution for a  given  application.  Finally,  the  surface  roughness  of the in-
            sulating sample has an effect  on the optimal  discharge  conditions  and  equilibra-
            tion  times E221. In the case of  very  rough  samples,  greater amou~ts  of redeposition
            are  required to fill crevices  in the surface  with  the  conductive  overcoating,




            The major  advantage of  using  the  secondary  cathode  method  for nonconductor
            analysis is that  the  sample is analyzed  directly  in its native form. Because  grind-
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