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12 MEMS Packaging for

Space Applications

R. David Gerke and Danielle M. Wesolek

CONTENTS

12.1 Introduction to Functions of MEMS Packages......................................... 269
12.1.1 Mechanical Support...................................................................... 270
12.1.2 Protection from Environment....................................................... 270
12.1.2.1 Simple — Mechanical Only........................................ 270
12.1.2.2 Traditional — Hermetic and Non-Hermetic............... 271
12.1.2.3 Custom — Vacuum Sealed Hermetic......................... 271
12.1.3 Electrical Connection to Other System Components .................. 271
12.2 Types of MEMS Packages ........................................................................ 272
12.2.1 Metal Packages............................................................................. 272
12.2.2 Ceramic Packages......................................................................... 273
12.2.3 Thin-Film Multilayer Packages.................................................... 274
12.2.4 Plastic Packages............................................................................ 274
12.3 Package-to-MEMS Attachment................................................................. 275
12.4 Thermal Management Considerations ...................................................... 276
12.5 Multichip Packaging.................................................................................. 278
12.5.1 MCM/HDI..................................................................................... 278
12.5.1.1 COF/HDI Technology ................................................. 278
12.5.2 Flip-Chip....................................................................................... 278
12.5.3 System on a Chip.......................................................................... 280
12.6 Example Applications of MEMS for Space ............................................. 281
12.6.1 Variable Emittance Coating Instrument for
Space Technology 5 ..................................................................... 281
12.6.2 Flat Plasma Spectrometer for the USAFA FalconSAT-3............ 282
12.6.3 Micromirror Arrays for the James Webb Space
Telescope ...................................................................................... 284
12.7 Conclusion ................................................................................................. 285
References............................................................................................................. 286

12.1 INTRODUCTION TO FUNCTIONS OF MEMS PACKAGES
A package serves to integrate all of the components required for a system applica-
tion in a manner that minimizes size, cost, mass, and complexity. It provides the
interface between the components and the overall system. The following subsec-
tions present the three main functions of the microelectromechanical systems

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