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                    Handling and Contamination Control for Critical Space Applications  303


                    or changes in absorptivity of a thermal control surface, which will eventually reduce
                    its effectiveness and cause loss of performance. It is necessary to minimize contri-
                    bution to spacecraft contamination through outgassing product in modern MEMS
                    packaging materials. All nonmetallic materials should be selected for low
                    outgassing characteristics and baked out in meeting their outgassing requirements.
                    The thermal vacuum bake is an effective method to assure that outgassed
                    materials have been removed. Generally, the hotter and longer the item can be
                    baked, the better the chance that the item will not contaminate the chamber or test
                    article. Space flight hardware are typically baked at 508C or higher, under 5   10  6
                    torr vacuum environment for at least 48 h unless otherwise noted. Visible degradation
                    of the material during bakeout will obviously result in the rejection of the material.
                    Some materials must be qualified for use by monitoring the outgassing levels during
                    the bakeout. The use of MSFC-SPEC-1238 14  is recommended for critical optical
                    applications. Bakeouts of MEMS devices are required unless it can be satisfactorily
                    demonstrated that the contamination allowance can be met without bakeouts.
                       MEMS devices operated on-orbit require proper protection from various
                    contamination sources. Plume impingement poses a great threat to MEMS devices
                    with both thermal heating and contamination degradation effects. Propulsion sys-
                    tems and attitude control systems are major contributors to plume contamination.
                    Plumes contain particulates that may be impinged on the exposed surfaces. For
                    example, solid rocket motors emit Al 2 O 3 and gaseous HCl, H 2 O, CO, CO 2 ,N 2 , and
                    H 2 . The shuttle Orbiter and International Space Station may also release water
                    vapor and ice particles along with gases leaking from the pressurized cabins. 15  To
                    warrant proper on-orbit operations, it is necessary to protect MEMS devices from
                    plume impingement. The protection is attained by a combination of mitigation
                    methods including placing plume shields, optimizing thruster operations, or install-
                    ing active decontamination devices.

                    13.6.6 CONTAMINATION CONTROL ON SPACE TECHNOLOGY 5
                    The Space Technology 5 (ST5) mission, as part of NASA’s New Millennium
                    Program (NMP), is a technology demonstration mission designed and managed
                    by NASA Goddard Space Flight Center (GSFC) that consists of three nanosatellites
                    flying in Earth’s magnetosphere. A thermal management method developed by
                    NASA and JHU/APL as one of the demonstration techniques of variable emittance
                    surfaces is a MEMS-based device that regulates the heat rejection of the small
                    satellite. 16  This system consists of MEMS arrays of gold-coated sliding shutters,
                    fabricated with the Sandia ultraplanar, multilevel MEMS technology fabrication
                    process, which utilizes multilayer polycrystalline silicon surface micromachining.
                    The shutters can be operated independently to allow digital control of the effective
                    emissivity.
                       For variable emissivity radiators the concerns of contamination and
                    handling drove the packaging design. The shutters open only 6 mm by 105 mm
                    with a concern that a small particle can lodge in the devices within the hinges of
                    the MEMS shutters and prohibit movement. Placing a protective window over the





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