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Osiander / MEMS and microstructures in Aerospace applications DK3181_c014 Final Proof page 309 1.9.2005 12:47pm

14 Material Selection for

Applications of MEMS

Keith Rebello

CONTENTS

14.1 Introduction................................................................................................ 310
14.2 Scaling Laws.............................................................................................. 310
14.3 Material Selection...................................................................................... 311
14.4 Material Failures........................................................................................ 312
14.4.1 Stiction ........................................................................................ 312
14.4.2 Delamination............................................................................... 312
14.4.3 Fatigue......................................................................................... 313
14.4.4 Wear............................................................................................ 313
14.5 Environmental Considerations .................................................................. 313
14.5.1 Vibration ..................................................................................... 313
14.5.2 Shock........................................................................................... 314
14.5.3 Temperature ................................................................................ 314
14.5.4 Atomic Oxygen........................................................................... 315
14.5.5 Radiation..................................................................................... 316
14.5.6 Particles....................................................................................... 317
14.5.7 Vacuum....................................................................................... 317
14.5.8 Humidity ..................................................................................... 318
14.6 Materials .................................................................................................... 318
14.6.1 Single Crystal Silicon................................................................. 318
14.6.2 Polysilicon................................................................................... 319
14.6.3 Silicon Nitride............................................................................. 319
14.6.4 Silicon Dioxide ........................................................................... 320
14.6.5 Metals.......................................................................................... 320
14.6.6 Polycrystalline Diamond ............................................................ 320
14.6.7 Silicon Carbide ........................................................................... 321
14.6.8 Polymers and Epoxies ................................................................ 321
14.6.9 SU-8 ............................................................................................ 321
1
14.6.10 CP1 .................................................................................... 322
14.7 Conclusion ................................................................................................. 324
References............................................................................................................. 324

309

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