Page 329 - MEMS and Microstructures in Aerospace Applications

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323
Material Selection for Applications of MEMS
13.2
7.1,
13.4
17.3
4.5
3.3
8.1
1
25
1
12
Thermal
1.4
235
1,200
25
80
91
2,000
490
33
178
485
2,480
9,000
to
400
130
2,100
660
251
850
Knoop
8,500
7,500
0.228
0.208
Strain
7.22
0.14
0.15
11.79
0.62
0.75
0.54
0.31
Specific
0.303
0.21
0.11
0.23
0.06
15.14
1.62
0.12
0.28
0.5
s/r Thermal Conductivity Hardness Tolerance, Strength, (10 26 /K) Expansion (W/m/K) (kg/mm 2 ) (vMPa) s 3/2 /E (MN*m/kg) 2.35 150 to 850 1.5 1.7 1,100 2.8 150 to 1,070 0.43 0.77 1,275 0.55 1.38 820 0.43 0.45 0.8 19 3,486 0.1 0.3 DK3181_c014 Final Proof page 323 1.9.2005
Specific Stiffness, E/r(MN*m/kg) 72 76 36 92 23 25 99 130 295 296 25 21 27 37
Indices 36,37 Fracture Strength, (MPa) s 4,000 1,800 1,000 1,000 500 300 2,000 2,000 5,030 53,000 12,600 4,000 1,000 600
Performance Young’s Modulus, (GPa) e to 129 187 176 73 304 207 69 393 430 967 1,035 196 410 221 97
and Density, (kg/m 3 ) r 2,330 2,330 2,200 3,300 8,900 2,710 3,970 3,300 3,510 3,500 7,800 19,300 8,050 2,650
Properties diamond diamond
14.9 dioxide nitride oxide carbide steel (Z-axis) © 2006 by Taylor & Francis Group, LLC
TABLE Material Material Silicon Polysilicon Silicon Silicon Nickel Aluminum Aluminum Silicon Nanocrystalline Single-crystal Iron Tungsten Stainless Quartz