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                    15          Reliability Practices for

                                Design and Application


                                of Space-Based MEMS




                                Robert Osiander and M. Ann Garrison Darrin


                    CONTENTS

                    15.1  Introduction to Reliability Practices for MEMS....................................... 327
                    15.2  Statistically Derived Quality Conformance and
                         Reliability Specifications........................................................................... 328
                    15.3  Physics of Failure (POF) Approach.......................................................... 329
                    15.4  MEMS Failure Mechanisms...................................................................... 331
                         15.4.1 Material Incompatibilities ............................................................ 331
                         15.4.2 Stiction.......................................................................................... 332
                         15.4.3 Creep............................................................................................. 333
                         15.4.4 Fatigue .......................................................................................... 333
                                15.4.4.1 Fracture ........................................................................ 334
                    15.5  Environmental Factors and Device Reliability......................................... 334
                         15.5.1 Combinations of Environmentally Induced Stresses ................... 335
                         15.5.2 Thermal Effects ............................................................................ 341
                         15.5.3 Shock and Vibration..................................................................... 342
                         15.5.4 Humidity ....................................................................................... 342
                         15.5.5 Radiation....................................................................................... 342
                         15.5.6 Electrical Stresses......................................................................... 343
                    15.6  Conclusion ................................................................................................. 344
                    References............................................................................................................. 344

                    15.1 INTRODUCTION TO RELIABILITY PRACTICES FOR MEMS

                    Reliability is the ability of a system or component to perform its required functions
                    under stated conditions for a specified period of time. 1
                       This chapter begins with the classification of failures for spacecraft compon-
                    ents. They are generally categorized as:

                       (1) Failures caused by the space environment, such as damage to circuits by
                          radiation
                       (2) Failures due to the inadequacy of some aspect of the design
                       (3) Failures due to the quality of the spacecraft or of parts used in the design or
                       (4) A predetermined set of ‘‘other’’ failures, which include operational errors 2

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