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                    Impact of Space Environmental Factors on Microtechnologies       81


                    high voltage and power efficiency, collect electrons from plasma, accumulating a
                    substantial negative charge. To prevent the highly polarized station from
                    losing large amounts of current, a plasma contactor generates a local high-density
                    plasma to contact the ambient plasma, maintaining the system electric potential
                          18
                    at zero.
                       AO exists in significant amounts around low-Earth orbits and around Mars.
                    AO is highly reactive and will react differently depending on the nature of the
                    materials involved. AO effects were first detected during shuttle missions. Exposure
                    to AO tends to cause metals to develop an oxide on their surface and polymers to
                    lose mass and undergo a change in surface morphology. Due to their high reactiv-
                    ities with AO, polymers and other composites need to be protected. On an order of
                    magnitude of scale, surfaces such as the solar arrays will be exposed to a stronger
                                                                                    7
                    AO flux field than inboard components. The LEO range for AO exposure is 10 to
                               3
                      8
                    10 atoms/cm . Exposure to AO is a known detriment to Kapton 1  (DuPont High
                    Performance Materials, Circleville, OH) wire as AO reduces the thickness of
                    insulation materials and degrades their insulating properties. A thin, protective
                    coating of silicon oxide is often used on Kapton solar array substrates for protection
                    against AO threats.

                    4.5 CONCLUSION

                    This chapter is cursory and of an introductory nature giving merely an overview
                    rather that handling any topic in depth. The consideration of inserting MEMS and
                    microstructures in critical space flight programs must include the potential stresses
                    that the piece, part, or component will be exposed to and each of their respective
                    impact on the long-term survivability of the subsystem. In the reliability portion of
                    this book there is a greater discussion on the combinations of stress factors from the
                    various potential environments.

                    4.6 MILITARY SPECIFICATIONS AND STANDARDS REFERENCED

                    MIL-PFR-19500 General Specification for Semiconductors
                    MIL-M-38510 General Specification for Microelectronic Devices
                    MIL-STD-202 Test Methods for Electronic and E1ectrical Component Parts
                    MIL-STD-338 Electronic Design Reliability Handbook
                    MIL-STD-750 Test Methods for Semiconductor Devices
                    MIL-STD-883 Test Methods for Microelectronic Devices
                    MIL-STD-975 NASA Standard Electrical, Electronic, and Electromechanical
                      (EEE) Parts List
                    MIL-STD-1540 (USAF) Test Requirements for Space Vehicles
                    MIL-STD-1541 (USAF) Electromagnetic Compatibility Requirements for Space
                      Systems
                    FED-STD-209 Clean Room and Work Station Requirements, Controlled Environ-
                      ment





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