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4-68 MEMS: Design and Fabrication

UV-light
Chromium mask
Photoresist
Titanium layer
(sacrificial layer)

Substrate
(A)

Synchrotron radiation
X-ray mask (titanium
membrane, gold absorber
structures)
X-ray resist

Structurized
sacrificial layer

(B)

Resist

Substrate
(C)

Electrodeposited metal,
e.g., nickel

(D)

Movable part of
microdevice

(E)

FIGURE 4.50 Movable LIGA microstructures. (Reprinted with permission from Mohr, J. et al. [1990] “Movable
Microstructures Manufactured by the LIGA Process as Basic Elements for Microsystems,” in Microsystem Technologies
90, Reichl, H., ed., pp. 529–37, Springer, Berlin.)

applications than PMMA. PC, well known for molding compact discs, is under development and should
perform well [Rogner et al., 1992].
Other materials that can flow or that can be sintered, such as glasses and ceramics, can be incorporated
in the LIGA process as well. In the case of ceramics, for example, plastic microstructures are used as dis-
posable or lost molds. The molds are filled with a slurry in a slip-casting process. Before sintering at high

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