Page 14 - A Practical Guide from Design Planning to Manufacturing
P. 14
xii Contents
Sequentials 216
Circuit Checks 220
Timing 221
Noise 226
Power 231
Conclusion 235
Key Concepts and Terms 236
Review Questions 236
Bibliography 237
Chapter 8. Layout 239
Overview 239
Objectives 239
Introduction 239
Creating Layout 240
Layout Density 245
Layout Quality 253
Conclusion 259
Key Concepts and Terms 260
Review Questions 260
Bibliography 261
Chapter 9. Semiconductor Manufacturing 263
Overview 263
Objectives 263
Introduction 263
Wafer Fabrication 265
Layering 268
Doping 268
Deposition 272
Thermal oxidation 276
Planarization 278
Photolithography 279
Masks 280
Wavelength and lithography 282
Etch 286
Example CMOS Process Flow 289
Conclusion 300
Key Concepts and Terms 301
Review Questions 301
Bibliography 302
Chapter 10. Microprocessor Packaging 303
Overview 303
Objectives 303
Introduction 303
