Page 15 - A Practical Guide from Design Planning to Manufacturing

Contents xiii

Package Hierarchy 304
Package Design Choices 308
Number and configuration of leads 309
Lead types 311
Substrate type 313
Die attach 318
Decoupling capacitors 319
Thermal resistance 320
Multichip modules 323
Example Assembly Flow 325
Conclusion 328
Key Concepts and Terms 329
Review Questions 329
Bibliography 330

Chapter 11. Silicon Debug and Test 331
Overview 331
Objectives 331
Introduction 331
Design for Test Circuits 333
Post-Silicon Validation 338
Validation platforms and tests 339
A bug’s life 341
Silicon Debug 344
Silicon Test 350
Conclusion 353
Key Concepts and Terms 354
Review Questions 355
Bibliography 355

Glossary 357
Index 385