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82                 Polymer-based Nanocomposites for Energy and Environmental Applications


          Table 3.3 Advantages and disadvantages of different encapsulation
          techniques [6]

          Encapsulation
          techniques        Advantages                    Disadvantages
          Macroencapsulation  l  Improved material compatible  l  Solidification at the
                               with surrounding material    edges
                               Improves PCM handling during  Poor thermal
                            l                             l
                               production                   conductivity or heat
                            l  External volume change effects  transfer characteristics
                               are mitigated
                            l  Preventing changes of its
                               composition through contact
                               with environment
                            l  Can serve directly as heat
                               exchangers
          Microencapsulation  l  Good control of volume change  l  Costly process
                               during the phase-change process  l  Can affect the strength
                               Easily incorporable into     of material
                            l
                               conventional building materials  l  Lead to supercooling
                            l  Enhancing conductive heat    effects
                               transfer between PCM and the
                               surrounding material
                            l  Thermal reliability is
                               considerably improved
                            l  Chemical stability is improved
                            l  Prevent PCM leakage by acting
                               as a barrier




         to reduce oozing rate of the paraffin from the shape-stabilized PCM when melting/
         freezing cycles are repeated. It was found that the prepared shape-stabilized PCM
         (74 wt% of paraffin and 26 w% of HDPE) had a heat of fusion of 121.4 kJ/kg and
         a melting temperature of 54.15°C. The micrograph in Fig. 3.3 showed that the paraffin
         as seen in the black part was dispersed in three-dimensional netted texture of HDPE as
         indicated at the white part and there was no leakage of the melted paraffin during the
         heat storage process.
            Xiao et al. [6] found that a maximum of about 80% of the paraffin can be encap-
         sulated into styrene-butadiene-styrene (SBS) without any infiltration of the molten
         paraffin. The heat of fusion and the melting temperature were determined as
         165.21 kJ/kg and 56–58°C, respectively.
            In order to overcome the problem of low thermal conductivity and in order to con-
         trol the encapsulation, the shape-stabilized PCM was mixed with exfoliated graphite.
         However, according to Zhang et al. [25], the product made of SBS/paraffin has the
         defect of rigidity, and if it has a large volume, it cannot be able to sustain its own
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