Page 11 - Sensors and Control Systems in Manufacturing

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Co n t e n t s

2.7.1 Principles of Operation . . . . . . . . . . 75
2.7.2 Features of Capacitive Sensors . . . . 77
2.7.3 Sensing Range . . . . . . . . . . . . . . . . . . 77
2.7.4 Target Material and Size . . . . . . . . . 78
2.7.5 Surrounding Conditions . . . . . . . . . 79
2.8 Understanding Limit Switches . . . . . . . . . . . 79
2.9 Inductive and Capacitive Sensors
in Manufacturing . . . . . . . . . . . . . . . . . . . . . . . 80
2.9.1 Relays . . . . . . . . . . . . . . . . . . . . . . . . . 81
2.9.2 Triac Devices . . . . . . . . . . . . . . . . . . . 82
2.9.3 Transistor DC Switches . . . . . . . . . . 84
2.9.4 Inductive and Capacitive
Control/Output Circuits . . . . . . . . . 85
2.9.5 Accessories for Sensor Circuits . . . . 87
2.9.6 Inductive and Capacitive Switching
Logic . . . . . . . . . . . . . . . . . . . . . . . . . . 88
2.9.7 Inductive and Capacitive Sensor
Response Time—Speed of
Operation . . . . . . . . . . . . . . . . . . . . . . 93
2.10 Understanding Microwave Sensing
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . 98
2.10.1 Characteristics of Microwave
Sensors . . . . . . . . . . . . . . . . . . . . . . . . 98
2.10.2 Principles of Operation . . . . . . . . . . 99
2.10.3 Detecting Motion with Microwave
Sensors . . . . . . . . . . . . . . . . . . . . . . . . 100
2.10.4 Detecting Presence with Microwave
Sensors . . . . . . . . . . . . . . . . . . . . . . . . 104
2.10.5 Measuring Velocity with Microwave
Sensors . . . . . . . . . . . . . . . . . . . . . . . . 105
2.10.6 Detecting Direction of Motion with
Microwave Sensors . . . . . . . . . . . . . 105
2.10.7 Detecting Range with Microwave
Sensors . . . . . . . . . . . . . . . . . . . . . . . . 106
2.10.8 Microwave Technology
Advancement . . . . . . . . . . . . . . . . . . 109
2.11 Confocal Microscopy Sensors . . . . . . . . . . . . . . 110
2.11.1 Confocal Profi ling Characterization
Systems . . . . . . . . . . . . . . . . . . . . . . . 110
2.11.2 Driving Inspection
Requirements . . . . . . . . . . . . . . . . . . 111
2.11.3 Probe-Mark Inspection
Requirements . . . . . . . . . . . . . . . . . . 113
2.11.4 Multi-Chip Packages . . . . . . . . . . . . 113