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The Greening of IT
           144                  How Companies Can Make a Difference for the Environment



             Newer servers are now based on multicore processors that enable a single
           processor to perform multiple separate tasks simultaneously, run multiple
           applications on a single processor, or complete more tasks in a shorter
           amount of time. Chip manufacturers claim that multicore processors can
           reduce power and heat by up to 40 percent.
             Embedded cooling uses the Liebert XD cooling infrastructure to deliver
           high-efficiency cooling directly inside the rack. This approach brings cooling
           even closer to the source of heat and allows the cooling system to be opti-
           mized for a particular rack environment. An example of how effective this
           approach can be is the CoolFrame system from Egenera and Emerson
           Network Power. This system can prevent 20 kW of heat from an Egenera
           BladeFrame system from entering the room by removing the heat before it
           leaves the rack.
             Chip-level cooling takes this approach to the next level by helping to
           move heat away from the chip. As embedded and chip-level cooling solutions
           are deployed, a highly efficient three-tiered approach to data center cooling
           will emerge. In this approach, heat is effectively moved away from the chip
           and then cooled in the rack, with stable temperatures and humidity main-
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           tained by room air conditioners. These developments are not expected to
           reduce data center cooling requirements. Instead, they will result in an
           increase in the amount of computing power that can be supported by a par-
           ticular facility. As a result, the efficiency improvements made today will con-
           tinue to pay dividends well into the future as these new developments enable
           existing facilities to support densities that are not possible today.
             The cooling system represents a significant opportunity to improve effi-
           ciency. In many cases, relatively simple and inexpensive changes—such as
           improving room sealing, moving cables or other objects that obstruct airflow,
           or installing blanking panels—can pay immediate dividends. In addition,
           new technologies, such as variable capacity room air conditioners and sophis-
           ticated control systems, should be considered for their impact on efficiency.
           Finally, supplemental cooling systems provide a response to increased equip-
           ment densities that can increase the scalability and efficiency of existing cool-
           ing systems.
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