Page 95 - Troubleshooting Analog Circuits
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82                            7. Identifying and Avoiding Transistor Problems























                        I







              Figure 7.2.  When you hit a component or circuit with a pulse of real ESD, you can never be sure what
                        kind of trouble you’ll get-unless you’ve already tested it with an ESD simulator. (Photo
                        copyright Peggi Willis.)


                        cause enough I X R drop to force the entire emitter and its periphery to share the
                        current. Now, let’s halve the current and double the voltage: The amount of dissipa-
                        tion is the same, but the I X R drop is cut in half. Now continue to halve the current
                        and double the voltage. Soon you’ll reach a point where the ballasting (Figure 7.3)
                        won’t be sufficient, and a hot spot will develop at a high-power point along the
                        emitter. The inherent decrease of VBE will cause an increase of current in one small
                        area. Unless this current is turned OFF promptly, it will continue to increase
                        unchecked. This “current hogging” will cause local overheating, and may cause the
                        area to melt or crater-this  is what happens in “secondary breakdown.” By definition
                        you have exceeded the secondary breakdown of the device. The designers of linear
                        ICs use ballasting, cellular layouts, and thermal-limiting techniques, all of which can
                        prevent harm in these cases (Ref. 3). Some discrete transistors are beginning to in-
                        clude these features.
                          Fortunately, many manufacturers’ data sheets include permitted safe-area curves at
                        various voltages and for various effective pulse-widths. So, it’s possible to design
                        reliable power circuits with ordinary power transistors. The probability of an unreli-
                        able design or trouble increases as the power level increases, as the voltage increases,
                        as the adequacy of the heat sink decreases, and as the safety margins shrink. For
                        example, if the bolts on a heat sink aren’t tightened enough, the thermal path
                        degrades and the part can run excessively hot.
                          High temperature  per se does not cause a power transistor to fail. But, if the drive
                        circuitry was designed to turn a transistor ON and only a base-emitter resistor is
                        available to turn it OFF, then at a very high temperature, the transistor will turn itself
                        ON and there will be no adequate way to turn it OFF. Then it may go into secondary
                        breakdown and overheat and fail. However, overheating does not by itself cause
                        failure. I once applied a soldering iron to a 3-terminal voltage regulator-I  hung it
                        from the tip of the soldering iron-and  then ran off to answer the phone. When I
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