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Diamond thin films  81

































                                 Figure 5.3. Schematic representation of the physical and chemical processes
                                 occurring during diamond growth. The process gases first mix in the chamber
                                 before diffusing toward the substrate surface. En route, they pass through an
                                 activation region (e.g. a hot filament or electric discharge), which provides energy
                                 to the gaseous species. This activation causes molecules to fragment into reactive
                                 radicals and atoms, creates ions and electrons, and heats the gas up to
                                 temperatures approaching a few thousand degrees Celsius. Beyond the activation
                                 region, these reactive fragments continue to mix and undergo a complex set of
                                 chemical reactions until they strike and stick to the substrate surface. At this
                                 point, the species can either react with the surface, escape again back into the gas
                                 phase, or diffuse around close to the surface until an appropriate reaction site is
                                 found. If a surface reaction occurs, one possible outcome, if all the conditions are
                                 suitable, is diamond.

                                 from the hot filament surface is enough to do this, whereas in a plasma
                                 system, the H molecules are broken apart as a result of impacts by high
                                             2
                                 energy electrons. The resulting high concentration of atomic hydrogen is
                                 crucial for a number of main processes.

                                 (i)  Although in bulk diamond the carbon atoms are all fully tetrahedrally
                                    bonded (see Figure 5.1), at the surface there is effectively a ‘dangling
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