Page 11 - An Introduction to Microelectromechanical Systems Engineering

x Contents

The Structure of DNA 172
PCR 174
PCR on a Chip 174
Electrophoresis on a Chip 176
DNA Hybridization Arrays 180
Microelectrode Arrays 182
DNA Addressing with Microelectrodes 183
Cell Cultures over Microelectrodes 185
Summary 185
References 186
Selected Bibliography 187

CHAPTER 7
MEM Structures and Systems in RF Applications 189
Signal Integrity in RF MEMS 189
Passive Electrical Components: Capacitors and Inductors 190
Quality Factor and Parasitics in Passive Components 190
Surface-Micromachined Variable Capacitors 192
Bulk-Micromachined Variable Capacitors 195
Micromachined Inductors 197
Microelectromechanical Resonators 200
Comb-Drive Resonators 201
Beam Resonators 203
Coupled-Resonator Bandpass Filters 206
Film Bulk Acoustic Resonators 208
Microelectromechanical Switches 211
Membrane Shunt Switch 213
Cantilever Series Switch 213
Summary 214
References 214
Selected Bibliography 216

CHAPTER 8
Packaging and Reliability Considerations for MEMS 217
Key Design and Packaging Considerations 218
Wafer or Wafer-Stack Thickness 219
Wafer Dicing Concerns 219
Thermal Management 220
Stress Isolation 221
Protective Coatings and Media Isolation 222
Hermetic Packaging 223
Calibration and Compensation 224
Die-Attach Processes 225
Wiring and Interconnects 227
Electrical Interconnects 227
Microfluidic Interconnects 231
Optical Interconnects 232