Page 9 - An Introduction to Microelectromechanical Systems Engineering

viii Contents

Piezoresistivity 24
Piezoelectricity 26
Thermoelectricity 29
Summary 31
References 31
Selected Bibliography 32
CHAPTER 3
Processes for Micromachining 33
Basic Process Tools 34
Epitaxy 34
Oxidation 35
Sputter Deposition 35
Evaporation 36
Chemical-Vapor Deposition 37
Spin-On Methods 40
Lithography 40
Etching 44
Advanced Process Tools 55
Anodic Bonding 55
Silicon Direct Bonding 56
Grinding, Polishing, and Chemical-Mechanical Polishing 57
Sol-Gel Deposition Methods 58
Electroplating and Molding 58
Supercritical Drying 60
Self-Assembled Monolayers 61
SU-8 Photosensitive Epoxy 61
Photosensitive Glass 62
EFAB 62
Nonlithographic Microfabrication Technologies 63
Ultraprecision Mechanical Machining 64
Laser Machining 64
Electrodischarge Machining 65
Screen Printing 65
Microcontact Printing/Soft Lithography 66
Nanoimprint Lithography 67
Hot Embossing 67
Ultrasonic Machining 68
Combining the Tools—Examples of Commercial Processes 68
Polysilicon Surface Micromachining 69
Combining Silicon Fusion Bonding with Reactive Ion Etching 71
DRIE of SOI Wafers 71
Single Crystal Reactive Etching and Metallization 72
Summary 74
References 75
Selected Bibliography 77