Page 266 - An Introduction to Microelectromechanical Systems Engineering

Quality Control, Reliability, and Failure Analysis 245

Table 8.7 A Select List of Key Reliability and Quality Standards for Systems and Applications that Are Likely to
Incorporate MEMS or Microsystems
Standards Description Organization/Regulatory Body Web Site
ISO 9000 series Principles for general International Organization for www.iso.ch
quality management Standardization
QS 9000 Automotive quality Automotive Industry Action Group www.aiag.org
management
IEEE 1332 Program for reliability IEEE www.ieee.org
of electronic systems
IEEE 1413 Methodology for IEEE
reliability prediction
MIL-HDB-217 Reliability prediction U.S. Department of Defense dodssp.daps.mil
for electronics
MIL-STD-202 Test methods for U.S. Department of Defense
electronic components
MIL-STD-883 Test methods for U.S. Department of Defense
microelectronics
GR-63-CORE Standard for Telcordia Technologies www.telcordia.com
environmental criteria
for telecom equipment
GR-463-CORE Standard for the Telcordia Technologies
reliability of
optoelectronic devices
GR-1209-CORE Standard for the Telcordia Technologies
reliability of branched
optical devices
GR-1221-CORE Standard for the Telcordia Technologies
reliability of passive
optical devices
21 CFR Parts Clearance pursuant to U.S. Food and Drug Administration, www.fda.gov/cdrh
800-1299 Title 21 Code of Center for Devices and
Federal Regulations Radiological Health

temperature stresses and electrical voltages are applied for an extended duration of
time with operation at maximum load under different ambient temperatures.
One example of extensive reliability standards is the GR-CORE series from
Telcordia Technologies for telecommunication components and equipment. These
standards clearly outline test conditions for shock, vibration, temperature, and
humidity cycling, accelerated aging as well as other test parameters to evaluate the
rate of infant mortality and gauge the long-term reliability of the product. Many of
the tests defined under the Telcordia standards originate from the MIL standards
defined by the U.S. Department of Defense for the operation of components for
military applications. For example, the GR-63, 463, 1209, and 1221 CORE stan-
dards that define the reliability tests specifically for optoelectronic and passive
fiber-optical components (see Table 8.8) explicitly reference the MIL-STD-202 and
883 standards. Procedures and methods also accompany the MIL standards to
guide the user in performing the tests and interpreting the data. For example, the
MIL-HDBK-H-108 provides sampling procedures and tables for reliability and life
testing, and the MIL-HDBK-217 discusses reliability prediction (e.g., calculation of
failure rates and mean time to failures) of electronic equipment [26].
An industry of professional consultants and advisors specializing in quality and
reliability standards has come to exist. The manufacturer of MEMS products is well