Page 46 - An Introduction to Microelectromechanical Systems Engineering
P. 46

Important Material Properties and Physical Effects                             25

                                                       Parallel direction
                                                                  Sense element
                                   Alignment
                                   marks
                                                                   Backing film




                                                                Orthogonal
                                                                direction


                                            Solder
                                            tab


                  Figure 2.4  A typical thin metal foil strain gauge mounted on a backing film. Stretching of the
                  sense element causes a change in its resistance.




                  dimensional changes: under stress, the resistor gets longer, narrower, and thinner
                  [17]. C. S. Smith’s discovery in 1954 [18] that the piezoresistive effect in silicon
                  and germanium was much greater (by roughly two orders of magnitude) than in
                  metals spurred significant interest. The first pressure sensors based on diffused
                  (impurity-doped) resistors in thin silicon diaphragms were demonstrated in 1969
                  [19]. The majority of today’s commercially available pressure sensors use silicon
                  piezoresistors.
                      For the physicist at heart, piezoresistivity arises from the deformation of the
                  energy bands as a result of an applied stress. In turn, the deformed bands affect the
                  effective mass and the mobility of electrons and holes, hence modifying resistivity.
                  For the engineer at heart, the fractional change in resistivity, ∆ρ/ρ, is to a first order
                  linearly dependent on σ and σ , the two stress components parallel and orthogonal
                                       //    ⊥
                  to the direction of the resistor, respectively. The direction of the resistor is here
                  defined as that of the current flow. The relationship can be expressed as

                                           ∆ρ ρ=  π σ +  π σ ⊥
                                                          ⊥
                                                     //
                                                   //
                  where the proportionality constants, π and π , are called the parallel and
                                                                ⊥
                                                        //
                  perpendicular piezoresistive coefficients, respectively, and are related to the gauge
                        2
                  factor by the Young’s modulus of the material. The piezoresistive coefficients
                  depend on crystal orientation and change significantly from one direction to the
                  other (see Table 2.4). They also depend on dopant type (n-type versus p-type) and
                  concentration. For {100} wafers, the piezoresistive coefficients for p-type elements
                  are maximal in the <110> directions and nearly vanish along the <100> direc-
                  tions. In other words, p-type piezoresistors must be oriented along the <110> direc-
                  tions to measure stress and thus should be either aligned or perpendicular to the
                  wafer primary flat. Those at 45º with respect to the primary flat (i.e., in the <100>
                  direction), are insensitive to applied tensile stress, which provides an inexpensive


            2.  The gauge factor, K, is the constant of proportionality relating the fractional change in resistance, ∆R/R,to
               the applied strain, ε, by the relationship ∆R/R = K⋅ε.
   41   42   43   44   45   46   47   48   49   50   51