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Protection concepts ‘m’, ’0’ and  ‘9’ 21 3


                  (1994)7 which  is  not  dissimilar), except  those  which  have  one  winding
                 wound over the other and are not separated by an earthed screen (type 2a
                 transformers).

                  9.1.5 The encapsulation process

                 The standard recognizes two types of  encapsulation which are, first, embed-
                  ding, which is the situation where normally the encapsulant is poured over
                  the electrical circuits in a mould which is later removed, leaving the encap-
                  sulant as the outer part of  the apparatus. (A mould may not be necessary,
                  the important fact being that the encapsulant is the outer part of  the appa-
                  ratus and is in contact with the environment.
                    Second, potting, which is a similar process except that the mould remains
                  adhered  to  the encapsulant and  forms the external surface of  the  appa-
                  ratus protecting the encapsulant from the environment. Where the mould
                  does not have a lid, it is acceptable to cover the encapsulant with another
                  encapsulant which adheres to the main encapsulant but protects it from the
                  environment.
                    The  Standard defines the  minimum thickness of  encapsulant between
                  conductors and the  surface of  the encapsulant as 3mm but  reduces this
                  requirement  to  lmm where  the  encapsulated  apparatus  has  no  single
                  surface greater than  2cm2 or  is  potted  in  a  metallic  mould  or  housing.
                  Where the mould is an insulator there is no minimum limit, provided the
                  mould is at least 1 rrun thick. In addition, the thickness of  encapsulant round
                  a void, such as a relay box within the encapsulant, is required to be 3mm
                  unless the void is less than 1 cm3 when the thickness is reducible to 1 mm.
                    Anything exiting the encapsulant is a possible route for entry of  explo-
                  sive atmosphere and must be effectively sealed. The Standard suggests that
                  5 mm of  bare conductor within the encapsulant is acceptable to ensure effec-
                  tive sealing of  connection cables which exit the encapsulant.
                    There are also minimum requirements for separation of  bare live parts be
                  they within the same circuit, in two separate circuits or one circuit and the
                  frame (earth) of  the apparatus and these are given in Table 9.1. Obviously
                  they only apply, as do all other requirements, where failure will affect the
                  protection concept.


                  9.1.6 Particular component problems
                  As in many of  the other Standards, certain types of  component are singled
                  out  as  having  particular  problems  insofar  as  the  protection  concept  is
                  concerned.


                  Fuses
                  To avoid problems with ingress of  encapsulant into the fuse cartridge, fuses
                  are required to be enclosed types to BS 4265 (1977) (1984)’l or IEC 269.” It is
                  recognized that during rupturing such fuses might exceed the temperature
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