Page 127 - Electrical Safety of Low Voltage Systems
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110   Chapter Six


                                  system from TT turns into IT, without having the safety requirements
                                  characteristic of this system (see Chap. 9).


                             6.10 Main Equipotential Bonding
                                  As anticipated in Chap. 4, the equipotentialization between ECPs and
                                  EXCPs, which can be simultaneously touched, reduces to safe values,
                                  oreliminates,potentialdifferencesarisenbetweenthem,inearthfaults
                                  conditions.
                                     Equipotentialization is practically achieved by connecting all the
                                  EXCPs to the grounding system. In particular, the following items
                                  must be linked together at the main grounding bus of the building to
                                  realize the main equipotential bonding (MEB) (Fig. 6.17):

                                         Pipes supplying services within the building (e.g., gas, cold

                                         water, etc.)
                                         Central heating and air-conditioning systems (if present)

                                         Structural metallic parts of building

                                         Reinforcing bars embedded in concrete

                                         Circuit protective conductors

                                         Main grounding conductor

                                     The EXCPs originating outside of the building must be bonded as
                                  close as is practical to their point of entry within the building.
                                     The remarkable “by-product” of the main equipotentialization is
                                  the reduction of the resistance of the house grounding system be-
                                  cause the EXCPs act as electrodes in parallel to the made-electrode(s)






















                                  FIGURE 6.17 Main equipotential bonding.
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