Page 220 - Engineered Interfaces in Fiber Reinforced Composites
P. 220

202               Engineered  interfaces in jiber reinforced composites

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                                             -100nm   fibrils
                                             -10nm  microfibrils


                       Fig. 5.22. Schematic illustration of UHMWPE fiber’s structural hierarchy. After Ward (1985).


                    ically shown in Fig. 5.22 (Ward, 1985). The polyethylene fibers have modulus and
                    strength values close to those of  aramid and Type I carbon fibers. Representative
                    properties  of  typical  UHMWPE  fibers  (Spectra  900  and  1000)  are  given  in
                    Table 5.12. Because of the extremely low density (= 0.97 g/cm3), their specific tensile
                    properties are the highest ever achieved with any organic materials. They also have a
                    high failure strain. In contrast to the high strength properties in tension, they have a
                    very low  compressive strength which could severely limit the application of  these
                    fibers.
                      Polyethylene fibers are  chemically  inert,  which  is  considered  to  be  a  positive
                    factor,  allowing  excellent  sunlight  resistance  and  little  degradation  in  aqueous
                    environment, as compared to other  organic and inorganic fibers. However, their
                    chemical inertness does not  allow  sufficient interactions to  occur to  form a  high
                    interfacial bond with most polymer resins. Significant efforts have been put forward
                    to improving the fiber-resin  adhesion by introducing the functionalities at the fiber
                    surface that could interact with organic resins. As for the aramid fibers discussed in
                    the preceding section, three methods have  been explored for polyethylene fibers,
                    namely chemical etching, plasma treatment and coupling agents.
                      Many different etchants have been  studied, including potassium permanganate
                    (KMn02), hydrogen peroxide (H202) and chromic acid (K2Cr207). Among these,
                    chromic acid shows the most promising result of a six-fold increase in interfacial
                    bonding of Spectra 1000 fibers with an epoxy resin in the microbond test, Table 5.13
                    (Silverstein and Breuer, 1993b). This remarkable gain is attributed to the removal of
                    oxygen-rich weak boundary layers which are present on the non-polar fiber surfaces,
                    and subsequently exposing the fibrillar structure of the fiber core by the strong acid.
                    The severe surface rugosity created by  the acid  also has contributed,  to  a lesser
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