Page 327 - Engineering Plastics Handbook
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Polyamide-imide (PAI)  285

        TABLE 12.8  Polyimide-imide Cure Schedules
                               Coatings
        Torlon AI-10
         ( 25 µm, 25% in NMP)

        Time, min         Temperature, °C       Temperature, °F
           60                  149                  300
           15                  260                  500
            5                  315                  600
                                 Molded parts

        Torlon injection-       Parts with max.
         molded grades (4203L,   cross-sectional
         4301, 4275, 4435,       thickness of
         5030,7130) [29]         0.3 in (7.6 mm)
        Days            Temperature, °C         Temperature, °F
          1                  149                     300
          1                  191                     375
          1                  204                     400
          1                  218                     425
          1                  232                     450
          1                  243                     470
          1                  252                     485
         10                  260                     500



        Curing process
        Polyamide-imide polymers require a thermal cure cycle to achieve max-
        imum properties after they have been formed into the final article,
        whether it is a coating or injection-molded part. Polyamide-imides have
        relatively low molecular weight to facilitate melt processing or coating
        applications. The articles themselves, before cure, are actually weak,
        brittle, and poor in chemical and wear resistance, and they do not have
        optimum thermal resistance. The curing process involves heating the
        polyamide-imide material in a batch process such as a forced-air oven;
        or, in the case of coatings, they may cured in a continuous process due
        to the shorter time scale involved. The cure cycle is dependent on the
        thickness of the polyamide-imide article and its geometry. For parts the
        temperature cycle is ramped slowly upward to allow stress relaxation and
        diffusion of moisture, created in the curing reactions, out of the part.
        Different cure cycles may be required, depending on the application
        requirements.
          During the curing process, the molecular weight of the polymer
        increases by chain extension, any remaining amic acids will imidize,
        and cross-links are created between the polymer chains. These reactions
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